منابع مشابه
Atomic layer deposition of transition metals.
Atomic layer deposition (ALD) is a process for depositing highly uniform and conformal thin films by alternating exposures of a surface to vapours of two chemical reactants. ALD processes have been successfully demonstrated for many metal compounds, but for only very few pure metals. Here we demonstrate processes for the ALD of transition metals including copper, cobalt, iron and nickel. Homole...
متن کاملDetermination of Electro Less Deposition by Chemical Nickeling
M. Badida, M. Gombár, L. Sobotová, J. Kmec, Faculty of Mechanical Engineering, Technical University of Košice, Slovakia Increasing of technical level and reliability of machine products in compliance with the economical and ecological terms belongs to the main trends of the industrial development. During the utilisation of these products there arise their each other contacts and the interaction...
متن کاملElectro-Assisted Deposition of Calcium Phosphate on Self-Assembled Monolayers
Calcium phosphate (CaP) ceramics are used in orthopedics and dentistry due to their excellent biocompatibility and osseointegration. Here, the electro-assisted deposition of CaP on two different selfassembled monolayers (SAMs), 2-mercaptoacetic acid (MAA) and 2-mercaptoethanol (ME), was studied both at short (up to 3 min) and long (2 hours) deposition periods on well-defined evaporated gold sur...
متن کاملOn Electro- and Thermomigration and Thermoelectric Transport Coefficients in Metals
für Naturforschung in cooperation with the Max Planck Society for the Advancement of Science under a Creative Commons Attribution 4.0 International License. Dieses Werk wurde im Jahr 2013 vom Verlag Zeitschrift für Naturforschung in Zusammenarbeit mit der Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. digitalisiert und unter folgender Lizenz veröffentlicht: Creative Commons Namen...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Scientific American
سال: 1874
ISSN: 0036-8733
DOI: 10.1038/scientificamerican12191874-393a